OUR PAPERS
* correspondence, † equal contribution
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Nature, Vol. 641, 98-105 (2025)Atomic lift-off of epitaxial membranes for cooling-free infrared detectionXinyuan Zhang†, Owen Ericksen†, Sangho Lee†, Marx Akl†, Min-Kyu Song, Haihui Lan, Pratap Pal, Jun Min Suh, Shane Lindemann, Jung-El Ryu, Yanjie Shao, Xudong Zheng, Ne Myo Han, Bikram Bhatia, Hyunseok Kim, Hyun S. Kum, Celesta S. Chang*, Yunfeng Shi*, Chang-Beom Eom* & Jeehwan Kim*
Nature, Vol. 636, 615-621 (2024)
Growth-based monolithic 3D integration of single-crystal 2D semiconductors
Ki Seok Kim†, Seunghwan Seo†, Junyoung Kwon†, Doyoon Lee†, Changhyun Kim†, Jung-El Ryu, Jekyung Kim, Jun Min Suh, Hang-Gyo Jung, Youhwan Jo, June-Chul Shin, Min-Kyu Song, Jin Feng, Hogeun Ahn, Sangho Lee, Kyeongjae Cho, Jongwook Jeon, Minsu Seol*, Jin-Hong Park*, Sang Won Kim* and Jeehwan Kim*

MIT News: MIT engineers grow “high-rise” 3D chips
ACS Nano, Vol. 18, 31225-31233 (2024)Route to Enhancing Remote Epitaxy of Perovskite Complex Oxide Thin Films
Sangho Lee†, Xinyuan Zhang†, Pooya Abdollahi, Matthew R. Barone, Chengye Dong, Young Jin Yoo, Min-Kyu Song, Doyoon Lee, Jung-El Ryu, Jun-Hui Choi, Jae-Hyun Lee, Joshua A. Robinson, Darrell G. Schlom, Hyun S. Kum, Celesta S. Chang*, Ambrose Seo* and Jeehwan Kim*
Nano Letters, Vol. 24, 9117–9128 (2024)Mixed-Dimensional Integration of 3D-on-2D Heterostructures for Advanced ElectronicsSangho Lee†, Min-Kyu Song†, Xinyuan Zhang†, Jun Min Suh, Jung-El Ryu and Jeehwan Kim*
Nature Nanotechnology, Vol. 19, 895–906 (2024)
The future of two-dimensional semiconductors beyond Moore’s law
Ki Seok Kim†, Junyoung Kwon†, Huije Ryu†, Changhyun Kim†, Hyunseok Kim†, Eun-Kyu Lee, Doyoon Lee, Seunghwan Seo, Ne Myo Han, Jun Min Suh, Jekyung Kim, Min-Kyu Song, Sangho Lee, Minsu Seol* and Jeehwan Kim*
Nature Electronics, Vol. 7, 416-418 (2024)
2D materials can unlock single-crystal-based monolithic 3D integrationKuangye Lu, Jaewoo Shim, Ki Seok Kim*, Sang Won Kim*, and Jeehwan Kim*
Nano Letters, Vol. 24, 2939-2952 (2024)
Remote Epitaxy: Fundamentals, Challenges, and Opportunities
Bo-In Park†, Jekyung Kim†, Kuangye Lu†, Xinyuan Zhang, Sangho Lee, Jun Min Suh, Dong-Hwan Kim*, Hyunseok Kim*, and Jeehwan Kim*
Nature Materials, Vol. 22, 1470-1477 (2023)
Monolithic 3D integration of 2D materials-based electronics towards ultimate edge computing solutions
Ji-Hoon Kang†, Heechang Shin†, Ki Seok Kim†, Min-Kyu Song†, Doyoon Lee, Yuan Meng, Chanyeol Choi, Jun Min Suh, Beom Jin Kim, Hyunseok Kim, Anh Tuan Hoang, Bo-In Park, Guanyu Zhou, Suresh Sundaram, Phuong Vuong, Jiho Shin, Jinyeong Choe, Zhihao Xu, Rehan Younas, Justin S. Kim, Sangmoon Han, Sangho Lee, Sun Ok Kim, Beomseok Kang, Seungju Seo, Hyojung Ahn, Seunghwan Seo, Kate Reidy, Eugene Park, Sungchul Mun, Min-Chul Park, Suyoun Lee, Hyung-Jun Kim, Hyun S. Kum, Peng Lin, Christopher Hinkle, Abdallah Ougazzaden, Jong-Hyun Ahn*, Jeehwan Kim* & Sang-Hoon Bae*
Featured as the front cover of Nature Materials in December 2023.

Nature Materials News & Views: All-2D electronics for AI processing
Science Advances, Vol. 9 (42), eadj537 (2023)
Remote epitaxial interaction through graphene
Celesta S. Chang†, Ki Seok Kim†, Bo-In Park†, Joonghoon Choi†, Hyunseok Kim, Junseok Jeong, Matthew Barone, Nicholas Parker, Sangho Lee, Xinyuan Zhang, Kuangye Lu, Jun Min Suh, Jekyung Kim, Doyoon Lee, Ne Myo Han, Mingi Moon, Yun Seog Lee, Dong-Hwan Kim*, Darrell G. Schlom*, Young Joon Hong*, and Jeehwan Kim*
Nature Electronics Research Highlight: Growing materials remotely
ACS Nano, Vol. 17 (13), 11994-12039 (2023)
Recent Advances and Future Prospects for Memristive Materials, Devices, and Systems
Min-Kyu Song†, Ji-Hoon Kang†, Xinyuan Zhang, Wonjae Ji, Alon Ascoli, Ioannis Messaris, Ahmet Samil Demirkol, Bowei Dong, Samarth Aggarwal, Weier Wan, Seok-Man Hong, Suma George Cardwell, Irem Boybat, Jae-sun Seo, Jang-Sik Lee, Mario Lanza, Hanwool Yeon, Murat Onen, Ju Li, Bilge Yildiz, Jesús A. del Alamo, Seyoung Kim, Shinhyun Choi, Gianluca Milano, Carlo Ricciardi, Lambert Alff, Yang Chai, Zhongrui Wang, Harish Bhaskaran, Mark C. Hersam, Dmitri Strukov, H.-S. Philip Wong, Ilia Valov, Bin Gao, Huaqiang Wu, Ronald Tetzlaff, Abu Sebastian, Wei Lu, Leon Chua, J. Joshua Yang, and Jeehwan Kim*
Nature Nanotechnology, Vol. 18, 464-470 (2023)
High-throughput manufacturing of epitaxial membranes from a single wafer by 2D materials-based layer transfer process
Hyunseok Kim†, Yunpeng Liu†, Kuangye Lu†, Celesta S. Chang†, Dongchul Sung, Marx Akl, Kuan Qiao, Ki Seok Kim, Bo-In Park, Menglin Zhu, Jun Min Suh, Jekyung Kim, Junseok Jeong, Yongmin Baek, You Jin Ji, Sungsu Kang, Sangho Lee, Ne Myo Han, Chansoo Kim, Chanyeol Choi, Xinyuan Zhang, Hyeong-Kyu Choi, Yanming Zhang, Haozhe Wang, Lingping Kong, Nordin Noor Afeefah, Mohamed Nainar Mohamed Ansari, Jungwon Park, Kyusang Lee, Geun Young Yeom, Sungkyu Kim, Jinwoo Hwang, Jing Kong, Sang-Hoon Bae, Yunfeng Shi*, Suklyun Hong*, Wei Kong* and Jeehwan Kim*
Nature, Vol. 614, 81–87 (2023)
Vertical full-colour micro-LEDs via 2D materials-based layer transfer
Jiho Shin†, Hyunseok Kim†, Suresh Sundaram†, Junseok Jeong†, Bo-In Park, Celesta S. Chang, Joonghoon Choi, Taemin Kim, Mayuran Saravanapavanantham, Kuangye Lu, Sungkyu Kim, Jun Min Suh, Ki Seok Kim, Min-Kyu Song, Yunpeng Liu, Kuan Qiao, Jae Hwan Kim, Yeongin Kim, Ji-Hoon Kang, Jekyung Kim, Doeon Lee, Jaeyong Lee, Justin S. Kim, Han Eol Lee, Hanwool Yeon, Hyun S. Kum, Sang-Hoon Bae, Vladimir Bulovic, Ki Jun Yu, Kyusang Lee*, Kwanghun Chung*, Young Joon Hong*, Abdallah Ougazzaden*, and Jeehwan Kim*
The Economist: Researchers find a way to make VR headsets more realistic
Nature, Vol. 614, 88–94 (2023)
Non-epitaxial single-crystal 2D material growth by geometric confinement
Ki Seok Kim†, Doyoon Lee†, Celesta S. Chang†, Seunghwan Seo, Yaoqiao Hu, Soonyoung Cha, Hyunseok Kim, Jiho Shin, Ju-Hee Lee, Sangho Lee, Justin S. Kim, Ki Hyun Kim, Jun Min Suh, Yuan Meng, Bo-In Park, Jung-Hoon Lee, Hyung-Sang Park, Hyun S. Kum, Moon-Ho Jo, Geun Young Yeom, Kyeongjae Cho, Jin-Hong Park*, Sang-Hoon Bae* and Jeehwan Kim*
Nature Nanotechnology, Vol. 17 (10), 1054-1059 (2022)
Graphene nanopattern as a universal epitaxy platform for single-crystal membrane production and defect reduction
Hyunseok Kim†, Sangho Lee†, Jiho Shin†, Menglin Zhu, Marx Akl, Kuangye Lu, Ne Myo Han, Yongmin Baek, Celesta S. Chang, Jun Min Suh, Ki Seok Kim, Bo-In Park, Yanming Zhang, Chanyeol Choi, Heechang Shin, He Yu, Yuan Meng, Seung-Il Kim, Seungju Seo, Kyusang Lee, Hyun S. Kum, Jae-Hyun Lee, Jong-Hyun Ahn, Sang-Hoon Bae*, Jinwoo Hwang*, Yunfeng Shi* and Jeehwan Kim*
Science, Vol. 377 (6608), 859-864 (2022)
Chip-less wireless electronic skins by remote epitaxial freestanding compound semiconductors
Yeongin Kim†, Jun Min Suh†, Jiho Shin†, Yunpeng Liu†, Hanwool Yeon, Kuan Qiao, Hyun S. Kum, Chansoo Kim, Han Eol Lee, Chanyeol Choi, Hyunseok Kim, Doyoon Lee, Jaeyong Lee, Ji-Hoon Kang, Bo-In Park, Sungsu Kang, Jihoon Kim, Sungkyu Kim, Joshua A. Perozek, Kejia Wang, Yongmo Park, Kumar Kishen, Lingping Kong, Tomás Palacios, Jungwon Park, Min-Chul Park, Hyung-jun Kim, Yun Seog Lee, Kyusang Lee, Sang-Hoon Bae, Wei Kong, Jiyeon Han* and Jeehwan Kim*
IEEE Spectrum: E-Skin Sensors Go Chipless and Batteryless
Nature Materials News & Views: Compound semiconductor devices for the skin
Nature Electronics, Vol. 5 (6), 386–393 (2022)
Reconfigurable heterogeneous integration using stackable chips with embedded artificial intelligence
Chanyeol Choi†, Hyunseok Kim†, Ji-Hoon Kang†, Min-Kyu Song†, Hanwool Yeon, Celesta S. Chang, Jun Min Suh, Jiho Shin, Kuangye Lu, Bo-In Park, Yeongin Kim, Han Eol Lee, Doyoon Lee, Jaeyong Lee, Ikbeom Jang, Subeen Pang, Kanghyun Ryu, Sang-Hoon Bae, Yifan Nie, Hyun S. Kum, Min-Chul Park, Suyoun Lee, Hyung-Jun Kim, Huaqiang Wu*, Peng Lin* and Jeehwan Kim*
Nature Electronics News: Lego-like reconfigurable AI chips
Interesting Engineering: MIT built a new reconfigurable AI chip that can reduce electronic waste
Daily Beast: Future Phones Could Be as Easy to Build and Upgrade as LEGOs
Featured as the front cover of Nature Electronics in June 2022.

MIT News: Engineers build LEGO-like artificial intelligence chip
Nature Reviews Methods Primers, Vol. 2, 40 (2022)
Remote Epitaxy
Hyunseok Kim†, Celesta S. Chang†, Sangho Lee†, Jie Jiang, Junseok Jeong, Minseong Park, Yuan Meng, Jongho Ji, Yeunwoo Kwon, Xuechun Sun, Wei Kong*, Hyun S. Kum*, Sang-Hoon Bae*, Kyusang Lee*, Young Joon Hong*, Jian Shi* and Jeehwan Kim*
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APL Materials, Vol. 10, 041105 (2022)Atomic layer-by-layer etching of graphene directly grown on SrTiO3 substrates for high-yield remote epitaxy and lift-offKi Seok Kim, Ji Eun Kang, Peng Chen, Sungkyu Kim, Jongho Ji, Geun Young Yeom*, Jeehwan Kim* and Hyun S Kum*
Journal of Applied Physics, Vol. 130, 174901 (2021)
Role of transferred graphene on atomic interaction of GaAs for remote epitaxy
Hyunseok Kim, Jong Chan Kim, Yoongu Jeong, Jimyeong Yu, Kuangye Lu, Doyoon Lee, Naeun Kim, Hu Young Jeong*, Jeehwan Kim* and Sungkyu Kim*
Featured as the front cover of Journal of Applied Physics on 7 November 2021.
Science Advances, Vol. 7 (27), eabg8459 (2021)
Long-term reliable physical health monitoring by sweat pore–inspired perforated electronic skins
Hanwool Yeon†, Haneol Lee†, Yeongin Kim†, Doyoon Lee, Youngjoo Lee, Jong-Sung Lee, Jiho Shin, Chanyeol Choi, Ji-Hoon Kang, Jun Min Suh, Hyunseok Kim, Hyun S. Kum, Jaeyong Lee, Daeyeon Kim, Kyul Ko, Boo Soo Ma, Peng Lin, Sangwook Han, Sungkyu Kim, Sang-Hoon Bae, Taek-Soo Kim, Min-Chul Park, Young-Chang Joo, Eunjoo Kim, Jiyeon Han* and Jeehwan Kim*
ACS Nano, Vol. 15 (6), 10587–10596 (2021)
Impact of 2D–3D Heterointerface on Remote Epitaxial Interaction through Graphene
Hyunseok Kim†, Kuangye Lu†, Yunpeng Liu, Hyun S. Kum, Ki Seok Kim, Kuan Qiao, Sang-Hoon Bae, Sangho Lee, You Jin Ji, Ki Hyun Kim, Hanjong Paik, Saien Xie, Heechang Shin, Chanyeol Choi, June Hyuk Lee, Chengye Dong, Joshua A. Robinson, Jae-Hyun Lee, Jong-Hyun Ahn, Geun Young Yeom, Darrell G. Schlom and Jeehwan Kim*
Nano Letters, Vol. 21, 4013-4020 (2021)
Graphene Buffer Layer on SiC as a Release Layer for High-Quality Freestanding Semiconductor Membranes
Kuan Qiao†, Yunpeng Liu†, Chansoo Kim, Richard J. Molnar, Tom Osadchy, Wenhao Li, Xuechun Sun, Huashan Li, Rachael L. Myers-Ward, Doyoon Lee, Shruti Subramanian, Hyunseok Kim, Kuangye Lu, Joshua A. Robinson, Wei Kong* and Jeehwan Kim*
Nature Nanotechnology, Vol. 15, 574–579 (2020)
Alloying conducting channels for reliable neuromorphic computing
Hanwool Yeon†, Peng Lin†, Chanyeol Choi†, Scott H. Tan, Yongmo Park, Doyoon Lee, Jaeyong Lee, Feng Xu, Bin GaO, Huaquiang Wu, He Qian, Yifan Nie, Seyoung Kim and Jeehwan Kim*
Nature Nanotechnology News: Memristors with alloyed electrodes
Singularity Hub: MIT Wants to Put AI in Your Pocket With Confetti-Sized Brain Chip
Harvard SITN: Thinking with Memristors
Nature Nanotechnology, Vol. 15, 272-276 (2020)
Graphene-assisted spontaneous relaxation towards dislocation-free heteroepitaxy
Sang-Hoon Bae†, Kuangye Lu†, Yimo Han†, Sungkyu Kim†, Kuan Qiao, Chanyeol Choi, Yifan Nie, Hyunseok Kim, Hyun S. Kum, Peng Chen, Wei Kong, Beom-Seok Kang, Chansoo Kim, Jaeyong Lee, Yongmin Baek, Jaewoo Shim, Jinhee Park, Minho Joo, David A. Muller, Kyusang Lee* and Jeehwan Kim*
Nature, Vol. 578, 75-81 (2020)
Heterogeneous integration of singlecrystalline complex-oxide membranes
Hyun S. Kum†, Hyungwoo Lee†, Sungkyu Kim†, Shane Lindemann†, Wei Kong, Kuan Qiao, Peng Chen, Julian Irwin, June Hyuk Lee, Saien Xie, Shruti Subramanian, Jaewoo Shim, Sang-Hoon Bae, Chanyeol Choi, Luigi Ranno, Seungju Seo, Sangho Lee, Jackson Bauer, Huashan Li, Kyusang Lee, Joshua A. Robinson, Caroline A. Ross, Darrell G. Schlom, Mark S. Rzchowski, Chang-Beom Eom* and Jeehwan Kim*
Nature News & Views: A platform for making and transferring oxide films
Nature Electronics, Vol. 2, 439–450 (2019)
Epitaxial growth and layer-transfer techniques for heterogeneous integration of materials for electronic and photonic devices
Hyun Kum, Doeon Lee, Wei Kong, Hyunseok Kim, Yongmo Park, Yunjo Kim, Yongmin Baek, Sang-Hoon Bae, Kyusang Lee*, and Jeehwan Kim*
Nature Nanotechnology, Vol. 14, 927–938 (2019)
Path towards graphene commercialization from lab to market
Wei Kong, Hyun Kum, Sang-Hoon Bae, Jaewoo Shim, Hyunseok Kim, Lingping Kong, Yuan Meng, Kejia Wang, Chansoo Kim, and Jeehwan Kim*
Nature Materials, Vol. 18, 550–560 (2019)
Integration of bulk materials with two-dimensional materials for physical coupling and applications
Sang-Hoon Bae, Hyun Kum, Wei Kong, Yunjo Kim, Chanyeol Choi, Byunghun Lee, Peng Lin, Yongmo Park, and Jeehwan Kim*
Science, Vol. 362 (6415), 665-670 (2018)
Controlled crack propagation for atomic precision handling of wafer-scale two-dimensional materials
Jaewoo Shim†, Sang-Hoon Bae†, Wei Kong†, Doyoon Lee†, Kuan Qiao, Daniel Nezich, Yong Ju Park, Ruike Zhao, Suresh Sundaram, Xin Li, Hanwool Yeon, Chanyeol Choi, Hyun Kum, Ruoyu Yue, Guanyu Zhou, Yunbo Ou, Kyusang Lee, Jagadeesh Moodera, Xuanhe Zhao, Jong-Hyun Ahn, Christopher Hinkle, Abdallah Ougazzaden, and Jeehwan Kim*
IEEE Spectrum: Graphene Printing Technique “Silk Screens” Flexible Electronics
APL Materials, Vol. 6 (12), 120901 (2018)Perspective: Uniform switching of artificial synapses for large-scale neuromorphic arraysScott H Tan, Peng Lin, Hanwool Yeon, Shinhyun Choi, Yongmo Park, and Jeehwan Kim*
Carbon, Vol. 133, 78-89 (2018)
Recent progress in Van der Waals (vdW) heterojunction-based electronic and optoelectronic devices
Jaewoo Shim, Dong-Ho Kang, Yunjo Kim, Hyun Kum, Wei Kong, Sang-Hoon Bae, Ibraheem Almansouri, Kyusang Lee, Jin-Hong Park, and Jeehwan Kim*
Nature Materials, Vol. 17, 999–1004 (2018)
Polarity governs atomic interaction through two-dimensional materials
Wei Kong†, Huashan Li†, Kuan Qiao†, Yunjo Kim, Kyusang Lee, Yifan Nie, Doyoon Lee, Tom Osadchy, Richard J Molnar, D. Kurt Gaskill, Rachael L. Myers-Ward, Keven M. Daniels, Yuewei Zhang, Suresh Sundram, Yang Yu, Sang-hoon Bae, Siddharth Rajan, Yang Shao-Horn, Kyeongjae Cho, Abdallah Ougazzaden, Jeffrey C. Grossman*, and Jeehwan Kim*
IEEE Spectrum: Graphene Printing Technique “Silk Screens” Flexible Electronics
Featured as MIT spotlight on MIT homepage on 10/9/2018.

Nature News & Views: Transparency revealed
MIT News: Study opens route to flexible electronics made from exotic materials
Nature Materials, Vol. 17, 335–340 (2018)
SiGe epitaxial memory for neuromorphic computing with reproducible high performance based on engineered dislocations
Shinhyun Choi†, Scott Tan†, Zefan Li, Yunjo Kim, Chanyeol Choi, Pai-Yu Chen, Hanwool Yeon, Shimeng Yu, and Jeehwan Kim*
The Verge: MIT researchers say new chip design takes us closer to computers that work like our brains
eeNews: Low power artificial synapse chip points was to artificial brain
CNBC: MIT researchers develop new chip design to take us closer to computers that work like human brains
Featured as MIT spotlight on MIT homepage on 1/23/2018.

Nature News & Views: Tightening grip
MIT News: Engineers design artificial synapse for “brain-on-a-chip” hardware
Nature, Vol. 544, 340–343 (2017)
Remote epitaxy through graphene for two-dimensional material based layer transfer
Yunjo Kim†, Samuel S. Cruz†, Kyusang Lee†, Babatunde O. Alawode, Chanyeol Choi, Yi Song, Jared M. Johnson, Christopher Heidelberger, Wei Kong, Shinhyun Choi, Kuan Qiao, Ibraheem Almansouri, Eugene A. Fitzgerald, Jing Kong, Alexie M. Kolpak, Jinwoo Hwang, and Jeehwan Kim*
MIT News: Not stuck on silicon
EETimes: New Method Cuts Cost of GaAs Circuits
IEEE Spectrum: Graphene Makes Infinite Copies of Compound Semiconductor Wafers
Featured as the front cover of Nature on 4/20/2017.

Nature News & Views: Materials Science: Crystals align through graphene
Proceedings of the National Academy of Science, Vol. 114, 4082-4086 (2017)Unveiling the carrier transport mechanism in epitaxial graphene for forming wafer‐scale, single‐domain grapheneSang‐Hoon Bae, Xiaodong Zhou, Seyoung Kim, Yun Seog Lee, Samuel Cruz, Yunjo Kim, James B. Hannon, Yang Yang, Devendra K. Sadana, Frances M. Ross, Hongsik Park, and Jeehwan Kim*
MIT News: Researchers “iron out” graphene
Advanced Energy Materials, Vol. 6, 1600198 (2016)Atomic layer deposited aluminum oxide for interface passivation of Cu2ZnSn(S,Se)4 thin-film solar cellsYun Seog Lee, Talia Gershon, Teodor K. Todorov, Wei Wang, Mark T. Winkler, Marinus Hopstaken, Oki Gunawan, Jeehwan Kim*